RayPCB Engineering Tools
| Dielectric Constant (Dk) | 3.38 ±0.05 | @10GHz, 23°C |
| Dissipation Factor (Df) | 0.0027 | @10GHz, 23°C |
| Volume Resistivity | 1.7×10¹⁰ MΩ·cm | C-96/35/90 |
| Surface Resistivity | 5.7×10⁹ MΩ | C-96/35/90 |
| Electrical Strength | 31 kV/mm | IPC-TM-650 |
| Thermal Conductivity | 0.71 W/m·K | |
| CTE (X-axis) | 11 ppm/°C | -55 to 288°C |
| CTE (Y-axis) | 14 ppm/°C | -55 to 288°C |
| CTE (Z-axis) | 46 ppm/°C | -55 to 288°C |
| Glass Transition (Tg) | >280°C | TMA |
| Decomposition (Td) | 425°C | TGA |
| Peel Strength (1 oz Cu) | 6.0 lb/in | After solder float |
| Flexural Strength | 200 MPa | Lengthwise |
| Density | 1.79 g/cm³ | |
| Moisture Absorption | 0.06% | 48hr immersion |
| Flammability | UL 94 V-0 |
| Property | RO4003C ★ | FR-4 | RO4350B | RT/duroid 5880 |
|---|---|---|---|---|
| Dk @10GHz | 3.38 | 4.2-4.5 | 3.48 | 2.20 |
| Df @10GHz | 0.0027 | 0.02 | 0.0037 | 0.0009 |
| Tg (°C) | >280 | 130-140 | 280 | >500 |
| CTE Z (ppm/°C) | 46 | 60-70 | 32 | 237 |
| Thermal K (W/m·K) | 0.71 | 0.25 | 0.69 | 0.20 |
| Cost Index | $$ | $ | $$ | $$$$ |
| Lead-Free Compatible | ✓ | ✓ | ✓ | ✗ |
| Max Frequency | 40 GHz | ~3 GHz | 77 GHz | 110 GHz |